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ADVANTEST BLG-022829 Heated Wafer Stage, Precision Thermal Control Module

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The ADVANTEST BLG-022829 Heated PCB Stencil Printer Module is an advanced tool designed for high-precision surface mount technology (SMT) applications, providing enhanced control and efficiency in printed circuit board (PCB) assembly processes.

Operating Temperature Range:32°F to 140°F (0°C to 60°C)

Heating Element Material:High-grade Nichrome wire

Stencil Printing Resolution:0.001 mm (1 micron)

Max Assembly Height Capacity:25.4 mm (1 inch)

Printer Head Movement:Linear motor-driven for smooth operation

Power Supply:AC 110V / 220V, 50/60Hz

Dimensions:L 600mm x W 500mm x H 400mm

Net Weight:Approximately 100 kg

    The ADVANTEST BLG-022829 Heated Plate offers unparalleled precision in temperature control, essential for ensuring the reliability and functionality of electronic components during testing and production.

    Crafted from a robust nickel-chrome alloy heating element, this plate ensures fast, even heat distribution across its surface, minimizing hotspots and reducing the risk of damage to delicate components.

    With a maximum load capacity of 2 kilograms, it’s versatile enough for a wide range of applications, from small circuit boards to larger components requiring precise thermal management.

    Featuring a ±0.1°C control accuracy, the ADVANTEST BLG-022829 Heated Plate guarantees consistent results, enhancing the quality assurance process in electronics manufacturing.

    Built for efficiency, it consumes only 100 watts of power, making it an eco-friendly solution for any lab or manufacturing environment. Its compact size and lightweight design facilitate easy integration into existing setups.

ADVANTEST BLG-022829 Htd Planche




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